Design for Reliability by Dana Crowe, Alec Feinberg

By Dana Crowe, Alec Feinberg

This booklet is well a robust addition to the physique of data for Reliability execs and for any corporation that wishes to enhance the company competitiveness by means of bettering the product reliability.

The ebook essentially offers the right kind specialise in the buyer, however it additionally elaborates at the indisputable fact that one purchaser is the company corporation.

The publication exhibits the optimal series of DfR actions within the improvement stages. This e-book additionally has outstanding info for the categorical DfR parts. it's also an exceptional source for tips into particular information.

I just like the stability of pix with textual content and the pics extra very good extra understanding.

This is an exceptional chief that has documented the carried out perform during this book.

I didn't try and make certain each mathematical formulation.

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These devices are extremely susceptible to bias oscillations. Component availability may also lead to problems in obtaining sufficient quantities for performing statistically valid life tests based on discrete elements. This is typically a problem when components are not manufactured as products. The ability to model circuit reliability using process reliability results can be difficult. It is important that the reliability models correlate closely to what is observed when life tests are performed on actual products.

While the device under test is under pressure, the dye will penetrate any defects in the surface of the unit and enter the device cavity. After a given period of time, the unit is removed from the vessel, rinsed with the appropriate solvent to remove the surface dye, and placed under a black light. As the dye fluoresces, the physical characteristics of the leak and leak path can be observed. Since this is a destructive test, it is used for monitoring rather than for screening products. 6 Particle Impact Noise Detection (PIND) Particle impact noise detection is used to detect solder balls and other foreign substances in hermetically sealed packages.

As a screen, it is designed to indicate the types of structural and mechanical weaknesses not necessarily detected in vibration and mechanical shock. By establishing a nominal level, it may be used to detect and eliminate devices with lower-than-nominal mechanical strengths in any of the mechanical structures. 10 Humidity Humidity tests accelerate the effects that moisture can cause in components. Degradation results if materials have problems with moisture absorption and/or surface wetting. Problems include corrosion, changes in electrical properties, electrochemical reactions, and so forth.

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